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LEON-G100/G200 - System Integration Manual

GSM.G1-HW-09002-C Preliminary System description

Page 32 of 75

Second microphone input: direct connection of an electret condenser microphone, used in the headset

mode

Two speaker outputs:

First speaker output: a single ended low power audio output, can be used to directly connect a receiver

(earpiece) used in handset mode or in headset mode

Second speaker output: a differential high power audio output, can be used to directly connect a speaker or

a loud speaker used in ring-tones or in hands-free mode

Headset detection input

I2S digital audio interface

1.9.1 Analog Audio interface

1.9.1.1 Uplink path (microphone inputs)

The TX (uplink) path of the analog audio front-end on the module consists of two identical microphone circuits.

Two electret condenser microphones can be directly connected to the two available microphone inputs.

The main electrical specification requirements for the electret condenser microphone are 2.2 k as maximum

output impedance at 1 kHz and 2 V maximum standard operating voltage.

The following board-to-board pins are related to the uplink path (microphones inputs):

MIC_BIAS1: single ended supply to the first microphone and represents the microphone signal input used in

handset or hands free mode;

MIC_GND1: local ground for the first microphone;

MIC_BIAS2: single ended supply to the second microphone and represents microphone signal input used in

headset mode;

MIC_GND2: local ground for the second microphone.

For a description of the internal function blocks see Figure 24.

1.9.1.2 Downlink path (speaker outputs)

The RX (downlink) path of the analog audio front-end of the module consists of two speaker outputs available

on the following pins:

HS_P: low power single ended audio output available for handset or headset mode. This pin is internally

connected to the output of the single ended audio amplifier of the chipset;

SPK_N/SPK_P: high power differential audio output, available for hands free or ringer mode. These two

pins are internally connected to the output of the high power differential audio amplifier of the chipset.

For a description of the internal function blocks see Figure 24.

Warning: excessive sound pressure from headphones can cause hearing loss.

Detailed electrical characteristics of the low power single-ended audio receive path and the high power

differential audio receive path can be found in the LEON-G100/G200 Data Sheet [1].

Table 5 lists the signals related to analog audio functions.

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